000960资金流向_基于python的炒股软件开发

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Physical Solutions provides services inelectronic, microelectronic and system design, simulation,  processdevelopment, fabrication and consulting in the frequency range from DC tomicrowave.  Areas of expertise include advanced electronics, mixed signal,hybrids, multichip modules (MCM), integrated circuit (IC) design, sensors, lownoise, high power,  wide operating range and high temperature electronics,optics and photonics, micro-electromechanical sensors (MEMS), multiphysicssystems and Packaging (MP2), acoustic and ultrasonic systems as wellas advanced software, firmware embedded systems, digital signal processingsoftware and algorithm development, HDL and VHDL field programmable array((FPGA) programming, and signal integrity.  Simulation includes, SPICE(both Berkley and symbolic), and multiphysics finite element analysis (FEA),difference and differential equation FEA analysis, signal decomposition,compression, wavelet analysis and 2D and 3D custom simulations.  Consultingservices can be provided onsite.
 
Physical Solutions has over thirty years ofexperience in creating innovative and custom solutions for next generationsystems.  The impossible problem is our specialty and we do prototypeconstruction.
 

Physical Solutions is privately held.

high temperature electronics design simulationminiaturization hybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply high temperature electronics design simulation miniaturizationhybrid mcm multichip module mutiphysics packaging mp2 memsmicroelectromechanical sensor system ic asic fpga software firmware embeddedsystem optics photonics low noise power systems sensor transducer well loggingtools geothermal petroleum gas completion open hole spice model modeling widetemperature range artificial intelligence expert systems motor controlleractuator controller aerospace defense military radiation hardened rad hard statemachine vhdl hdl c++ interconnect signal integrity halt highly accelerated lifetesting high reliability emi esd thermal analysis fea finite element analysismethod of moments mom dsp wavelet numerical analysis acoustic ultrasonicelectronic systems control theory analysis magnetic transformer analog designdigital design simulation process development thin film thick film thermalsolutions heat pipe diamond heat sink vibration high reliability hermetic sealnonlinear systems tactical hypersonic aircraft carrier submarine army roboticsunmanned aircraft ucav miniaturized miniature super computer high temperaturepower supply
For more information contact Harold Snyder, Sr. Scientist, at 972-772-2651 orsend an e-mail to:  Harold.Snyder@physical-solutions-group.com

 

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